ERITECH® TGB & TMGB Ground Busbars meet specifications of TIA/EIA 607 and conform to BICSI recommendations.Features
- Complete offering of Telecommunications Main Grounding Busbar (TMGB) & Telecommunications Grounding Busbar (TGB) for central bonding of telecommunications equipment
- Electro-tin plated busbar provides superior connections by lowering contact resistance and minimizes requirements for cleaning
- UL & cUL Listed to UL467 & C22.2 respectively
- Stainless steel brackets and fasteners provide superior corrosion resistance
- Insulated standoffs provide busbar isolation
- Splice plates for both TGB and TMGB busbars allow for future expansion or the use of multiple smaller lengths to be used to meet system requirements
Applications
The TMGB is the dedicated extension of the building grounding electrode system for the telecommunications infrastructure.
The TGB centrally connects systems and equipment served by a telecommunications closet. Both the TMGB and the TGB are electro-tin plated to ensure low resistance corrosion free contact between the lugs and busbars. The bonding conductor between the TMGB and the TGB should be continuous and run in the most direct path possible. Often, the TGB is installed to the side of the panelboard. When the building's structural steel is effectively grounded, each TGB should be bonded to the steel within the same room with a No. 6 AWG conductor. Exothermic welding is recommended for these connections. Always use the shortest distance possible in the grounding system. More Information
ERITECH® TGB & TMGB Ground Busbars
Materials
Busbars:
- 6mm (1/4") thick Copper
- ASTM B187-C11000
- Electro-tin plated
Insulators:
- Manufactured of rugged polyamide, an environmentally friendly, halogen-free nylon material which is reinforced with glass fiber
- 51 mm (2") standoff height
- Meet the requirements of UL 94 VO for self-extinguishing materials
Brackets:
- Type 304 Stainless Steel
- 3 mm (1/8") thick
Fasteners:
Ordering Information
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